HA series is a pressure oven for semiconductor packaging process. 4 core technologies have brought the development of electronic products is semiconductor technology, semiconductor packaging technology, manufacturing technology and software technology. Semiconductor packaging technology usually means all kinds of electronic hardware technologies, consists of active element (semiconductor chip) and passive element(electric resistance, condenser), which is one of the most important and extensive technology. The important roles of semiconductor packaging is electric power supply, signaling connection between semiconductor elements, heat release and protecting electronic elements from environmental changes.
First step of semiconductor packaging is making semiconductor into single chip module by wire bond, TAB(Tape Automated Bonding) and Flip chip.
To make semiconductor module, in the process using Epoxy Resin such as Over mold and Underfill, removing air bubbles and voids is required to improve efficiency.
Ilshin Autoclave’s HA series is manufactured to harden Epoxy resin, remove air bubble by gas pressure such as nitrogen, and perform hardening / degreasing process at the same time.
Ilshin Autoclave Co.,Ltd has ASME Pressure vessel manufacturing certification stamps(U1, U2, U3) , designs and  manufacture equipment according to ASME regulations ensuring high safety and airtightness.
Ilshin Autoclave Co. Ltd designs the equipment with multiple options such as Magnedrive to maintain constant temperature, cooling coil for rapid cooling, automatic opening / closing cover, perfect insulation and heating for controlling temperature departure, automatic valve line for controlling pressure and multi-safety system.
Please refer to Options & Accessories for various options according to the purpose of use.