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| Home > System > Autoclave > Laminating Autoclave > HA series > Flip chip |
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Autoclave |
 Laminating Autoclave - HA Series [Flip Chip] |
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What is a Flip chip?
Flip chip is a method for interconnecting semiconductor devices, to external circuitry with solder bumps that have been deposited onto the chip pads. Flip chip is divided into FCIP(Flip Chip In Package) and FCOB(Flip Chip On Board) according to the interconnecting type. FCIP such as FC-PCA, FA-BGA and FC-CSP is usually applied for home appliances, telecommunications and computer and FCOB is applied for watch, vehicle, HDD and RFID.
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 Why Flip chip? |
| Packaging technology aim to improve performance with low cost, high packaging density and accurate circuit. When attach semiconductor chip into a circuit board, using a flip chip enables the ideal chip size. Because Flip chip minimize connecting length, more efficient than other interconnecting methods. There is only one terminal between chip and circuit board so semiconductor has more accurate circuit.
This is contrast to wire bonding, in which the chip is mounted upright and wires are used to interconnect the chip pads to external circuitry. The resulting completed flip chip assembly is much smaller than a traditional carrier-based system; the chip sits directly on the circuit board, and is much smaller than the carrier both in area and height. The short wires greatly reduce inductance, allowing higher-speed signals, and also conduct heat better.
The process was originally introduced commercially by IBM in the 1960s for individual transistors and diodes packaged for use in their mainframe systems. In the 1970s it was taken up by Delco Electronics, and has since become very common in automotive applications.
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| Advantages of Flip Chip |
| Small size |
Small IC attaching area (5% of QFP packaging IC), low and light |
| Functionality |
• Flip chip increases I/O count
• Many more signal, electricity and connection in small space.
• More than 400 pads are available |
| High performance |
• The short wires reduce inductance, allowing higher-speed signals, and also conduct heat better. |
| Reliability |
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Epoxy underfill ensure a reliability
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Flip chip reduce a connection per pins. |
| Low cost |
• Reduce the cost for bumping / underfill process |
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| Flip Chip connection |
| Flip Chip connection consists of many processes. They are connected by a bump, an electroconductive material. |
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| Flip Chip process |
| In the flip chip process, intergrated circuits are created on the wafer and solders are deposited on each of pads by electric gilding, solder inkjet or solid solder deposition. Chips are flipped and positioned so that the solder balls are facing the connectors. Solders are then re-melted by hot air flow. Mounted chip is underfilled using an adhesive. HA series is used for removing air bubbles in underfills to improve an efficiency. |
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