HA 760 has a large space to use a lot of trays and laminate many products. By installing the inside cooling system, we improved a cooling speed and process efficiency. It is used for removing air bubbles and voids in the semiconductor process using Epoxy Resin such as Over mold and Underfill. We improved process efficiency by performing hardening and degreasing the same time, and increased an output by tray that is available for various shapes of samples. It provides convenience test / production by pressure control system.
HA 440 is basically made from stainless steel for chemical resistance, and installed automatic opening / closing cover. It uses multi-line pressure system for safety and accurate air tightness during process.
Pipe line consists of air pump, air vent, safety vent and thermocouple. Additional options such as automatic emission line are also available.