HA 300 is a compact equipment for simple experiments and tests. We improved an efficiency of the process by a cooling system for rapid cooling. It is used for removing air bubbles or voids in the semiconductor process using Epoxy resin such as Over Mold and Underfill. This equipment performs isotropic compression with constant temperature. It is basically made from stainless steel for chemical resistance and applied clamp type cover for automatic opening / closing. HA 300 ensure a safety and air tightness for user by multi-line pressing method.